Imaging apparatus, manufacturing apparatus, manufacturing method and electronic appliance

ABSTRACT

The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 16/054,441, filed Aug. 3, 2018, which is acontinuation of U.S. patent application Ser. No. 14/903,110, filed onJan. 6, 2016, now U.S. Pat. No. 10,044,917, which is a National StageEntry of PCT/JP2014/071035, filed Aug. 8, 2014, and claims the benefitof priority from Japanese Priority Patent Application JP 2013-172536filed in the Japan Patent Office on Aug. 8, 2013, the entire contents ofwhich are hereby incorporated by reference.

TECHNICAL FIELD

The present technology relates to an imaging apparatus, a manufacturingapparatus, a manufacturing method, and an electronic appliance.Particularly, it relates to an imaging apparatus, a manufacturingapparatus, a manufacturing method, and an electronic appliance thatcontribute to miniaturization of a module.

BACKGROUND ART

In recent years, it has been desirable to miniaturize a digital camera,and with the spread of a cellular phone having a function of a digitalcamera, to miniaturize an autofocus driving apparatus and the like. Ithas been proposed to realize miniaturization by sealing a lens holder, achip and a circuit board (see Patent Literature 1).

CITATION LIST Patent Literature

Patent Literature 1: JP 2007-523568T

SUMMARY OF INVENTION Technical Problem

Although miniaturization of an optical system such as a lens makes itpossible to realize miniaturization of an imaging apparatus, undesirablestates such as a reduction in optical amount and deterioration in imagequality are highly likely to be generated. Therefore, it is notpreferable to miniaturize the imaging apparatus by miniaturizing a lensand the like. However, as described above, it has been desirable tofurther miniaturize the imaging apparatus.

The present technology has been developed in light of such a situation,and it is capable of realizing further miniaturization of the imagingapparatus.

Solution to Problem

An imaging apparatus according to an embodiment of the presenttechnology includes: a first circuit hoard in which an imaging elementis mounted on a center portion; a component that is mounted on an outercircumference portion of the center portion of the first circuit hoard;and a member that incorporates the component and is provided in theouter circumference portion.

The member can be formed by a mold method.

The imaging apparatus can further include: a lens barrel that holds alens. A frame that supports a portion including the lens barrel can belocated on the member.

The frame can include an infra red cut filter (IRCF).

One side of the first circuit board can connected to a second circuithoard. A reinforcement member for reinforcing connection between thefirst circuit hoard and the second circuit board can provided in apredetermined portion of the second circuit board and the member. Theimaging apparatus can further include: a lens barrel that holds a lens,A portion including the lens barrel can be located on the member.

The member can be formed in a shape having a step. An infra red cutfilter (IRCF) can be mounted on a portion of the step.

A portion of the first circuit board on which the imaging element is tobe mounted can be formed into a cavity. A second circuit hoard can beattached to a lower portion of the first circuit board, and the imagingelement can be mounted on the second circuit board.

The member can be formed by covering, with a predetermined mold, thefirst circuit board to which the component is attached, and injecting aresin to the mold.

A manufacturing apparatus according to an embodiment of the presenttechnology manufactures an imaging apparatus including a first circuitboard in which an imaging element is mounted on a center portion, acomponent that is mounted on an outer circumference portion of thecenter portion of the first circuit hoard, and a member thatincorporates the component and is provided in the outer circumferenceportion.

The member can be formed by covering, with a predetermined mold, thefirst circuit board to which the component is attached, and injecting aresin to the mold.

A manufacturing method according to an embodiment of the presenttechnology for a manufacturing apparatus that manufactures an imagingapparatus, the imaging apparatus including a first circuit board inwhich an imaging element is mounted on a center portion, a componentthat is mounted on an outer circumference portion of the center portionof the first circuit board, and a member that incorporates the componentand is provided in the outer circumference portion, includes: a step offorming the member by covering, with a predetermined mold, the firstcircuit hoard on which the component is mounted, and injecting a resinto the mold.

An electronic appliance according to an embodiment of the presenttechnology includes: an imaging apparatus including a first circuitboard in which an imaging element is mounted on a center portion, acomponent that is mounted on an outer circumference portion of thecenter portion of the first circuit board, and a member thatincorporates the component and is provided in the outer circumferenceportion; and a signal processing unit that performs signal processingfor a pixel signal outputted from the imaging element.

An imaging apparatus according to an embodiment of the presenttechnology at least includes a first circuit board on which an imagingelement is mounted in a center portion, a component mounted in an outercircumference portion of the center portion of the first circuit board,and a member incorporating the component and provided in the outercircumference portion.

In a manufacturing apparatus and a manufacturing method according to anembodiment of the present technology, the imaging apparatus ismanufactured.

In an electronic compliance according to an embodiment of the presenttechnology, the imaging apparatus is included.

Advantageous Effects of Invention

According to an embodiment of the present technology, it is possible tominiaturize the imaging apparatus.

Note that the effect described here is not limited, and may be anyeffect described in the present disclosure.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional diagram illustrating a configuration of animaging apparatus.

FIG. 2 is a diagram illustrating the imaging apparatus.

FIG. 3 is a cross-sectional diagram illustrating a configuration of alower part of the imaging apparatus.

FIG. 4 is a cross-sectional diagram illustrating another configurationof the lower part of the imaging apparatus.

FIG. 5 is a diagram for explaining manufacturing of the imagingapparatus.

FIG. 6 is a cross-sectional diagram illustrating another configurationof the imaging apparatus.

FIG. 7 is a diagram illustrating a configuration of an electronicappliance.

DESCRIPTION OF EMBODIMENTS

An aspect for implementing the present technology (hereinafter referredto as an embodiment) will be described below. Note that the descriptionwill be provided in the following order.

1. Configuration of Imaging Apparatus

2. Configuration of Lower Part of Imaging Apparatus

3. Manufacturing of Imaging Apparatus

4. Another Configuration of Lower Part of Imaging Apparatus

5. Electronic Appliance

<Configuration of Imaging Apparatus>

FIG. 1. is a cross-sectional diagram illustrating a configuration of animaging apparatus. Further, FIG. 2 is a diagram illustrating an exteriorconfiguration of the imaging apparatus. An imaging apparatus 10 of FIG.1 includes an upper part 11 and a lower part 12. Here, for convenienceof explanation, description is provided assuming that the imagingapparatus 10 includes the upper part 11 and the lower part 12.

The upper part 11 includes an actuator 21, a lens barrel 22, a lens 23,an infra red cut filter (IRCF) 24, and a frame 25. The lower part 12includes a first circuit board 31, a second circuit board 32, an imagingelement 33, a component 34 and a mold part 35.

A lens 23-1, a lens 23-2 and a lens 23-3 are incorporated in the insideof the lens barrel 22, and the lens barrel 22 holds those lenses 23-1 to23-3. The lens barrel 22 is contained in the actuator 21, and the lowerpart 12 is attached to the lower part of the actuator 21.

For example, a screw (not shown) is included on a side face in theoutside of the lens barrel 22, and a screw (not shown) is included atsuch a position as to be screwed to this screw in one part in the insideof the actuator 21, and the screw of the lens barrel 22 and the screw inthe inside of the actuator 21 are screwed to each other. The lens barrel22 is screwed to the actuator 21 in order to adjust a distance from theimaging element 33 (for focusing) during manufacturing. Note that such amethod for attaching the lens barrel 22 to the actuator 21 is anexample, and the lens barrel 22 may be attached to the actuator 21 byanother mechanism.

When the lens barrel 22 is configured to be movable in the verticaldirection in the drawing so that an auto-focus (AF) can be performed,for example, a coil is provided on a side face of the lens barrel 22 (alens carry having the lens barrel 22 attached thereto). Further, amagnet is provided at such a position as to face the coil in the insideof the actuator 21. A yoke is included in the magnet, and a voice coilmotor includes the coil, the magnet and the yoke.

When a current flows in the coil, force is generated in the verticaldirection in the drawing. This generated force moves the lens barrel 22in the upper direction or the lower direction. When the lens barrel 22is moved, a distance between the imaging element 33 and the lenses 23-1to 23-3 held by the lens barrel 22 is changed. Such a mechanism canrealize the auto-focus.

Note that another mechanism may realize the auto-focus, and aconfiguration is applied according to a method for realizing that.

The imaging element 33 is provided in the center portion of the lowerpart 12. The imaging element 33 is attached onto the first circuit board31 and connected to the first circuit board 31 by wiring 37. Theplurality of components 34 for processing a signal from the imagingelement 33 are arranged in a portion around the imaging element 33 inthe outer circumference part of the first circuit board 31 on the top ofthe first circuit board 31, and are attached onto the first circuithoard 31. This component 34 is arranged in such a manner that one sideis in contact with the first circuit hoard 31 and the other three sidesare surrounded by the mold part 35.

As described later, the mold part 35 is manufactured by, for example, amold method. Note that, although it is described as the mold part here,it is not limited to the mold, and as described later it may be a memberincorporating the components 34, functioning as a protection part forprotecting the components 34, and having a function as a holding partsupporting the upper part 11.

The frame 25 is attached to a face on a side opposite to the firstcircuit board 31 in the upper part of the mold part 35. This frame 25has a function holding the IRCF 24. Further, the lens barrel 22 andothers are provided on a side opposite to a side in contact with themold part 35, of the frame 25.

In one side of the first circuit hoard 31, a portion to which the secondcircuit board 32 is connected is provided. The second circuit board 32is, for example, a flexible print board (FPC), and is used as a circuitboard for supplying a signal from the first circuit board 31 to aconnector 41 as shown in FIG. 2.

The second circuit board 32 is attached so as to be put on the one sideof the first circuit board 31, but as shown in FIG. 1 and FIG. 2, areinforcement member 36 is provided in a part on the second circuitboard 32 in order to reinforce the attached portion.

<Configuration of Lower Part of Imaging Apparatus>

The imaging apparatus 10 to which the present technology is applied isconfigured to allow the thickness of the first circuit board 31 to bereduced and allow the components 34 to be protected from a shock or thelike, by causing the mold part 35 to support the frame 25. This will bedescribed with reference to FIG. 3.

FIG. 3 is an enlarged diagram illustrating a right side part of thelower part 12 of the imaging apparatus 10. As shown in FIG. 3, let alength from the right end of the component 34 to the right end of themold part 35 be a width a, and let a length from the left end of thecomponent 34 to the left end of the mold part 35 be a width b. Further,let a width of the component 34 be a width c.

As described later, the mold part 35 can be formed by injecting a resin.Injecting a resin to form the mold part 35 makes it possible to form themold part 35 while the components 34 are contained in the mold part 35and the mold part 35 is in contact with the components 34. Therefore, itcan be thought that the components 34 are incorporated in the mold part35 in a pseudo manner, and constitute a part of the mold part 35.Constituting a part of the mold part 35 means a state in which a load ofthe upper part 11 is applied to the mold part 35, but the load isapplied not only to the mold part 35 but to the components 34.

The load is dispersed when supporting the upper part 11 by thecomponents 34 and the mold part 35 more than when supporting the upperpart 11 only by the mold part 35, making it possible to prevent warpageand the like from being generated in the first circuit board 31. Thiswill be described in comparison with when the frame 25 is assumed to bein contact with the first circuit board 31 to support the upper part Liwithout providing the mold part 35.

FIG. 4 is a diagram illustrating a structure when the frame 25 is incontact with the first circuit board 31 to support the upper part 11without providing the mold part 35. Further, similarly to FIG. 3, FIG. 4is an enlarged diagram illustrating a right side part of the lower part12. Since the lower part 12 shown in FIG. 4 has a frame 61 having ashape different from that of the frame 25 of FIG. 3, and the otherstructural elements are similar to those of the lower part 12 of FIG. 4,they are denoted with the same signs and description will be continued.

In the lower part 12 shown in FIG. 4, the frame 61 is in direct contactwith the first circuit board 31. A portion of the frame 61 in contactwith the first circuit board 31 is optionally described as a leg. Asshown in FIG. 4, a length of the portion of the frame 61 in contact withthe first circuit hoard 31 is a width e, and a width of a space betweenthe left side of the leg portion of the frame 61 and the right side ofthe component 24 is a width f.

When the upper part 11 and the lower part 12 are integrated in such amanner that the components 34 are attached to the first circuit board 31and then the frame 61 is put on the first circuit board 31, it isnecessary to provide a gap between the component 34 and the leg of theframe 61 so as to prevent the leg of the frame 61 from coming intocontact with the component 34 when the frame 61 is put on the firstcircuit board 31. This gap is to be the width f.

When the frame 61 is directly put on the first circuit board 31, and theupper part 11 is put on the first circuit board 31, the leg portion ofthe frame 61 having the width e will support the upper part 11. When theleg portion (width e) is thinned, the load is concentrated on thethinned led portion. The leg portions of the frame 61 are provided atsuch positons as to surround the imaging element 33 in the outercircumference portion of the first circuit board 31.

That is, in this case, the load will be locally applied to the outercircumference portion of the first circuit board 31. When such a localload is applied, warpage may be generated in the first circuit hoard 31.In order to prevent the generation of such warpage, it is necessary toincrease the thickness of the first circuit board 31, or increase thewidth e of the leg portion of the frame 61.

Accordingly, when the frame 61 is provided so as to be in direct contactwith the first circuit board 31, it becomes necessary to provide acertain level of the width e and the gap width f.

In contrast, when the mold part 35 is provided, referring to FIG. 3again, the first circuit board 31 is in contact with the mold part 35 atthe width of the width a+the width b. Further, in consideration of thecomponents 34 incorporated in the mold part 35 in a pseudo manner, themold part 35 is in contact with the first circuit board 31 at the widtha+the width b+the width c. Therefore, the mold part 35 having the widthof the width a+the width b+the width c will support the upper part 11.

It is evident that the width a+the width b+the width c can be greaterthan the width e shown in FIG. 4. Further, when the width e is assumedto be set to the same width as the width a+the width b+the width c, thewidth of the leg portion of the frame 61 is increased, and thus it isnecessary to increase a size of the first circuit board 31 on which theframe 61 is put, thereby preventing the miniaturization of the imagingapparatus 10.

On the other hand, when the width a+the width b+the width c is assumedto be set to be the same width as the width e, the thickness of thewidth a or the width b may be reduced. Therefore, as shown in FIG. 3,when the mold part 35 is provided, it is possible to obtain aconfiguration contributing to the miniaturization of the imagingapparatus 10.

Furthermore, it is easy to set the width a+the width b+the width c to begreater than the width e. For example, when the width e is assumed to bethe same as the width c, the width a+the width b+the width c is greaterthan the width e by the width a+the width b. In this manner, when thewidth a+the width b+the width c can be increased, the load applied tothe first circuit board 31 by the upper part 11 can be dispersed.

The dispersion of the load allows the reason for the warpage of thefirst circuit board 31 to be eliminated. Therefore, when the mold part35 is provided, it is possible to reduce the thickness of the firstcircuit board 31. Also from this point of view, it is possible tominiaturize (thin) the imaging apparatus 10.

Furthermore, as described with reference to FIG. 4, when the frame 61 isin direct contact with the first circuit hoard 31, it is necessary toprovide the gap having the width f in consideration of the assembly ofthe imaging apparatus 10. In the mold part 35 shown in FIG. 3, however,it is not necessary to provide such a gap. Therefore, it is evident tominiaturize the first circuit board 31 by the width f.

When the mold part 35 is provided in this manner, it is possible tosupport the upper part 11 by the width a+the width b+the width c, makingit possible to miniaturize or thin the imaging apparatus 10. Further,when the upper part 11 can be supported by the width a+the width b+thewidth c, it becomes possible to improve the rigidity.

For example, even when force is applied to the imaging apparatus 10 fromabove, since the upper part 11 is supported by the width a+the widthb+the width c, the applied force can be dispersed to prevent damage tothe first circuit board 31 and others. Further, the components 34 areincorporated in the mold part 35 to allow the components 34 to beprotected by the mold part 35, making it possible to prevent thecomponents 34 from being damaged by the applied force.

<Manufacturing of Imaging Apparatus>

Next, manufacturing of the imaging apparatus 10 having the mold part 35described with reference to FIG. 1 to FIG. 3 will be descried inaddition.

At Step S1, the first circuit board 31 is set. As shown at Step S1, inthe first circuit board 31, a region on which the imaging element 33 isto be mounted is provided in the center portion, and a region on whichthe components are to be mounted is provided in the outer circumferenceportion of the center portion. Further, a region to be connected to thesecond circuit board 32 is provided on the right side in the drawing.

At Step S2, the components 34 are mounted on the first circuit board 31.As shown in FIG. 5, the plurality of components 34 are mounted on apredetermined portion of the first circuit board 31. Note that, in thedrawing at Step S2 shown in FIG. 5, there has been shown the examplewhere the components 34 are mounted on the upper portion and the lowerportion of the first circuit board 31, respectively, but the components34 may be also mounted on another portion, for example, the rightportion or the left portion.

At Step S3, mold-sealing is performed. A mold 201 having a predeterminedshape is put on the first circuit board 31 on which the components 34are mounted, and a resin is injected to the mold 201 to perform themold-sealing.

The mold 201, as shown in Step S3 of FIG. 5, is shaped so as to coverthe components 34, and is shaped so as to surround the outercircumference portion of the first circuit board 31 at a predeterminedwidth.

Further, in the mold 201, a width on a side in contact with the firstcircuit board 31 as a width of an inner wall interval is set to thewidth a+the width b+the width c, and a width on a side opposite to thatface and on which the frame 24 is to be put is set to the width d. Notethat this width is not necessarily the same in every portion of the mold201, and as shown in FIG. 5, a width of the mold 201 arranged in thehorizontal direction in the drawing may be set to be different from awidth of the mold 201 arranged in the vertical direction. Further, apredetermined portion may be formed thicker than another portion.

At Step S4, the mold part 35 is formed by removing the mold 201. Atsubsequent steps, the imaging element 33 is mounted on the centerportion of the first circuit board 31, and the upper part 11 is put onthe mold part 35 to manufacture the imaging apparatus shown in FIG. 1(not shown).

The case where the mold 201 is used to perform the mold-sealing to formthe mold part 35 has been described here as an example, but thecomponents 34 may be sealed by another method to form the mold part 35.

For example, the first circuit board 31 may be covered with the moldpart 35 previously formed of a predetermined material and bondedthereto. In this case, for example, a space for storing the components34 may be previously formed in the inside of the mold part 35, but thecomponents 34 is preferably covered with the mold part 35 with a leastpossible gap.

Furthermore, the mold part 35 molded of a soft material may be pressedto the components 34 and attached to the first circuit hoard 31, andthen the mold part 35 may be formed on the first circuit board 31 atsuch a step that the mold part 35 is cured.

Furthermore, the mold part 35 may use not a single material, but aplurality of materials. For example, a portion in contact with thecomponent 34, in other words, the inside of the mold part 35 may use arelatively soft material, and the outside of the mold part 35 may use arigid material.

Furthermore, when the mold 201 is used in forming the mold 35, theplurality of molds 201 may be used to finally form the mold part 35. Forexample, the mold 201, with which the components 34 are covered, may beused to inject a first material to form the mold part 35, with which thecomponents 34 are covered, and then a mold 201′ different from the mold201 used for the first time may be used to inject a second material toform the mold part 35 for the second time.

Note that the manufacturing step described with reference to FIG. 5 isan example, the mold part 35 and others may be manufactured at anotherstep. For example, there may be used such a step that the imagingelement 33 is attached to the first circuit board 31 and then the moldpart 35 is formed.

<Another Configuration of Lower Part of Imaging Apparatus>

FIG. 6 shows another configuration of the imaging apparatus. In animaging apparatus 100 of FIG. 10, since an upper part 11 basically hasthe same configuration as that of the imaging apparatus 10 of FIG. 1, itis denoted with the same sign and the description is omitted.

Although a lower part 112 also has the same configuration as that of thelower part 12 of FIG. 1, since the shape and the like are different,description is added to different portions. A mold part 135 of theimaging apparatus 100 of FIG. 6 is shaped so as to mount an IRCF 24. Asshown in FIG. 6, steps are provided in the inside of the mold part 135,and the IRCF 24 can be mounted on the steps.

In order to provide such steps in the mold part 135, a shape of the mold201 (FIG. 5) may be set to such a shape. Alternatively, the mold part 35without steps as shown in FIG. 1 may be formed, and then a portion wherethe steps are to be formed may be polished to form the steps.

In any case, the steps are provided in the mold part 135, and the IRCF24 is directly mounted on the steps of the mold part 135, therebyallowing an assembly flow to be simplified.

In the imaging apparatus 10 of FIG. 1, the frame 25 holds the IRCF 24.In the imaging apparatus 100 of FIG. 6, the IRCF 24 is mounted on themold part 135, thereby allowing the frame 25 to be omitted.

Accordingly, a step of manufacturing the frame 25, a step of mountingthe IRCF 24 on the frame 25, a step of mounting the frame 25 on thelower part 112, and the like can be omitted, thereby allowing theassembly flow to be simplified.

Furthermore, when the frame 25 is eliminated, it is possible to thin theimaging apparatus 100 by the thickness of the frame 25.

The center portion of a first circuit board 131 of the imaging apparatus100 of FIG. 6, on which an imaging element 133 is to be mounted, isformed into a space (cavity), and the imaging element 133 is stored inthe space. Further, a second circuit hoard 132 is attached to the backface of the first circuit board 131. That is, the imaging element 133 isdirectly mounted on the second circuit board 132, and the first circuitboard 131 is connected to the imaging element 133 by wiring 137. Such astructure can be called a die pad less structure.

The imaging element 133 is mounted on the second circuit board 132,thereby allowing the thickness of the lower part 112 to be suppressedmore than when the imaging apparatus 133 is mounted on the first circuitboard 131. That is, further thinning of the lower part 112 can berealized. The imaging apparatus 100 itself can be thereby thinned.

In this manner, according to the present technology, it is possible torealize further miniaturization and thinning of the imaging apparatus.Further, it is possible to improve the rigidity of the imagingapparatus. Further, it is possible to simplify the assembly flow.

<Electronic Appliance>

The present technology is not limited to the application to the imagingapparatus, it can be applied to electronic appliances in general usingan imaging apparatus for an image capturing unit (photoelectricconversion unit), such as image apparatuses such as a digital stillcamera and a video camera, portable terminal apparatuses having animaging function such as a cellular phone, copy machines using animaging apparatus for an image reading unit. Note that a module-likeform mounted on an electronic appliance, that is, a camera module may bean imaging apparatus.

FIG. 7 is a block diagram illustrating a configuration example of animaging apparatus as an example of an electronic appliance of thepresent disclosure. As shown in FIG. 7, an imaging apparatus 300 of thepresent disclosure includes an optical system including a lens group301, an imaging element 302, a DSP circuit 303 as a camera signalprocessing unit, a frame memory 304, a display device 305, a recordingdevice 306, an operation system 307, and a power supply system 308.

The DSP circuit 303, the frame memory 304, the display device 305, therecording device 306, the operation system 307, and the power supplysystem 308 are connected to each other through a bus line 309. A CPU 310controls each unit within the imaging apparatus 300.

The lens group 301 captures incident light (image light) from a subjectto form an image on an imaging surface. The imaging element 302 convertsa light amount of the incident light formed into the image on theimaging surface by the lens group 301 into an electric signal in a pixelunit and outputs the signal as a pixel signal. As the imaging element302, the solid-state imaging element according to the embodimentdescribed above can be used.

The display device 305 includes a panel-type display device such as aliquid crystal display device and an electro luminescence (EL) displaydevice, and displays a moving image or a still image captured by theimaging element 302. The recording device 306 records a moving image ora still image captured by the imaging element 302 in a recording mediumsuch as a video tape or a digital versatile disk (DVD).

The operation system 307 generates an operation command for variousfunctions held by the imaging apparatus under an operation by a user.The power supply system 308 optionally supplies various kinds of powersupplies to be an operation power supply of the DSP circuit 303, theframe memory 304, the display device 305, the recording device 306 andthe operation system 307, to these supply targets.

The imaging apparatus 300 is applied to a video camera, a digital stillcamera, and a camera module for a mobile device such as a cellularphone. The imaging apparatus 300 can use the imaging element accordingto the embodiment described above as the imaging element 302.

Furthermore, in the specification, the system represents a wholeapparatus including a plurality of devices.

Note that the effects described in the specification are merely anexample, and are not limited, and another effect may be possible.

The present technology is not limited to the above-describedembodiments, but various modifications are possible insofar as they arewithin the scope of the present technology.

Additionally, the present technology may also be configured as below.

(1)

An imaging apparatus including:

a first circuit board in which an imaging element is mounted on a centerportion;

a component that is mounted on an outer circumference portion of thecenter portion of the first circuit board; and

a member that incorporates the component and is provided in the outercircumference portion.

(2)

The imaging apparatus according to (1),

wherein the member is formed by a mold method.

(3)

The imaging apparatus according to (1) or (2), further including:

a lens barrel that holds a lens,

wherein a frame that supports a portion including the lens barrel islocated on the member.

(4)

The imaging apparatus according to (3),

wherein the frame includes an infra red cut filter (IRCF).

(5)

The imaging apparatus according to (1),

wherein one side of the first circuit hoard is connected to a secondcircuit board, and

wherein a reinforcement member for reinforcing connection between thefirst circuit board and the second circuit board is provided in apredetermined portion of the second circuit board and the member.

(6)

The imaging apparatus according to (1), further including:

a lens barrel that holds a lens,

wherein a portion including the lens barrel is located on the member.

(7)

The imaging apparatus according to (6),

wherein the member is formed in a shape having a step, and

wherein an infra red cut filter (IRCF) is mounted on a portion of thestep.

(8)

The imaging apparatus according to (6),

wherein a portion of the first circuit board on which the imagingelement is to be mounted is formed into a cavity, and

wherein a second circuit board is attached to a lower portion of thefirst circuit board, and the imaging element is mounted on the secondcircuit hoard.

(9)

The imaging apparatus according to any of (1) to (8),

wherein the member is formed by covering, with a predetermined mold, thefirst circuit board to which the component is attached, and injecting aresin to the mold.

(10)

A manufacturing apparatus that manufactures an imaging apparatus, theimaging apparatus including

a first circuit board in which an imaging element is mounted on a centerportion,

a component that is mounted on an outer circumference portion of thecenter portion of the first circuit board, and

a member that incorporates the component and is provided in the outercircumference portion.

(11)

The manufacturing apparatus according to (10),

wherein the member is formed by covering, with a predetermined mold, thefirst circuit board to which the component is attached, and injecting aresin to the mold.

(12)

A manufacturing method for a manufacturing apparatus that manufacturesan imaging apparatus, the imaging apparatus including

a first circuit board in which an imaging element is mounted on a centerportion,

a component that is mounted on an outer circumference portion of thecenter portion of the first circuit board, and

a member that incorporates the component and is provided in the outercircumference portion,

the manufacturing method including:

a step of forming the member by covering, with a predetermined mold, thefirst circuit board on which the component is mounted, and injecting aresin to the mold.

(13)

An electronic appliance including:

an imaging apparatus including

-   -   a first circuit board in which an imaging element is mounted on        a center portion,    -   a component that is mounted on an outer circumference portion of        the center portion of the first circuit board, and    -   a member that incorporates the component and is provided an the        outer circumference portion; and

a signal processing unit that performs signal processing for a pixelsignal outputted from the imaging element.

REFERENCE SIGNS LIST

-   10 imaging apparatus-   21 actuator-   22 lens barrel-   23 lens-   24 IRCF-   25 frame-   31 first circuit board-   32 second circuit board-   33 imaging element-   34 component-   35 mold part-   131 first circuit board-   132 second circuit board-   133 imaging element-   134 component-   135 mold part

The invention claimed is:
 1. An imaging apparatus, comprising: a firstcircuit board and a second circuit board connected to the first circuitboard; a lens configured to receive incident light; an imaging elementon a surface of the first circuit board, wherein the first circuit boardis configured to receive the incident light on the surface via the lens;a component on an outer circumference portion of the surface of thefirst circuit board, wherein the component is configured to process asignal received from the imaging element; an intermediate member thatsurrounds the outer circumference portion of the surface of the firstcircuit board; and a reinforcement member on a portion of the secondcircuit board and the intermediate member, wherein the reinforcementmember is configured to reinforce the connection between the firstcircuit board and the second circuit board.
 2. The imaging apparatusaccording to claim 1, further comprising: an infrared cut filter betweenthe imaging element and the lens; and a frame coupled to the componentvia the intermediate member.
 3. The imaging apparatus according to claim2, further comprising a lens barrel on a side of the frame, wherein thelens is held by the lens barrel.
 4. The imaging apparatus according toclaim 3, wherein the frame supports the lens barrel.
 5. The imagingapparatus according to claim 1, wherein the component is injectionmolded.
 6. The imaging apparatus according to claim 2, wherein a portionof the component has a step shape, and the infrared cut filter is on thestep shape of the component.
 7. The imaging apparatus according to claim2, wherein the frame comprises a first portion which extends in a firstdirection perpendicular to an optical axis of the lens, the firstportion of the frame holds the infrared cut filter, the frame comprisesa second portion which extends in a second direction opposite to thefirst direction, a side of the second portion is in contact with a sideof the component via the intermediate member, the side of the secondportion faces the first circuit board, and the side of the component isopposite to the first circuit board.
 8. The imaging apparatus accordingto claim 5, wherein a side of the component is in contact with the firstcircuit board.
 9. An imaging system, comprising: a first circuit boardand a second circuit board connected to the first circuit board; a lensconfigured to receive incident light; an imaging element on a surface ofthe first circuit board and electrically coupled to the first circuitboard via a wire, wherein the imaging element is configured to generateimage data, and the first circuit board is configured to receive theincident light on the surface via the lens; a component on an outercircumference portion of the surface of the first circuit board, whereinthe component is configured to process a signal received from theimaging element; an intermediate member that surrounds the outercircumference portion of the surface of the first circuit board; areinforcement member on a portion of the second circuit board and theintermediate member, wherein the reinforcement member is configured toreinforce the connection between the first circuit board and the secondcircuit board; an infrared cut filter between the imaging element andthe lens; a frame coupled to the component via the intermediate member;and a processor coupled to the imaging element, wherein the processor isconfigured to process the image data.
 10. The imaging system accordingto claim 9, wherein the frame comprises a first portion which extends ina first direction perpendicular to an optical axis of the lens, thefirst portion of the frame holds the infrared cut filter, the framecomprises a second portion which extends in a second direction oppositeto the first direction, a side of the second portion is in contact witha side of the component via the intermediate member, the side of thesecond portion faces the first circuit board, and the side of thecomponent is opposite to the first circuit board.